Asrock B860M STEEL LEGEND WIFI, Intel B860, 1851, Micro ATX, 4 DDR5, HDMI, DP, TB4, Wi-Fi 6E, 2.5G LAN, RGB, 4x M.2

Asrock B860M STEEL LEGEND WIFI, Intel B860, 1851, Micro ATX, 4 DDR5, HDMI, DP, TB4, Wi-Fi 6E, 2.5G LAN, RGB, 4x M.2

£161.38

  Steel Legend represents the philosophical state of rock-solid durability and irresistible aesthetics. Built around most demanding specs and features, the Steel Legend series aims at daily users and mainstream enthusiasts! Providing a …

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SKU: ASMBB860MSTEELLEGENDWIFI Categories: ,

Description

 

Steel Legend represents the philosophical state of rock-solid durability and irresistible aesthetics. Built around most demanding specs and features, the Steel Legend series aims at daily users and mainstream enthusiasts! Providing a strong array of materials/components to ensure a stable and reliable performance.

  • Supports Intel® Core™ Ultra Processors (Series 2) (LGA1851)
  • 12+1+1+1+1 Power Phase, 80A SPS for VCore+GT+SA
  • 4 x DDR5 DIMMs
  • Supports Dual Channel, up to 8666+ (OC)
  • 1 PCIe 5.0 x16
  • Graphics Output Options: 1 HDMI, 1 DisplayPort, 1 Thunderbolt™ 4 Type-C
  • Realtek ALC1220 7.1 CH HD Audio Codec, Nahimic Audio
  • 4 SATA3
  • 1 Blazing M.2 (PCIe Gen5x4)
  • 3 Hyper M.2 (PCIe Gen4x4)
  • 1 Thunderbolt™ 4 Type-C (Rear)
  • 3 USB 3.2 Gen2 (2 Rear, 1 Front Type-C)
  • 6 USB 3.2 Gen1 (4 Rear, 2 Front)
  • 6 USB 2.0 (2 Rear, 4 Front)
  • Realtek 2.5G LAN
  • 802.11axe Wi-Fi 6E + Bluetooth
 
 

 

Performance
  • Exclusive 20K Cap with 1000uF Capacitance – The upgraded 20K Black capacitor not only extends the lifespan to 20,000 hours but also increases the capacitance value from 560uF to 1000uF
  • 12+1+1+1+1 Power Phase Design – Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.
  • SPS (Smart Power Stage) – Dr.MOS design features the latest SPS (Smart Power Stage) technology. It’s optimized for monitoring current and temperature of each phase, thus delivering smoother and neater power to the CPU with enhanced performance and OC capability.
  • Hi-Density Power Connector – CPU overclocking requires higher current. ASRock Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power connectors, providing a more stable system and reducing the risk of fire during heavy overclocking.
  • 2oz Copper PCB – 2 ounce copper inner layers that provide stable signal traces and power shapes! Delivering lower temperature and higher energy efficiency for overclocking.
  • DDR5 XMP & EXPO Support – Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboard is b

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